- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/62 - Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
Patent holdings for IPC class H01R 13/62
Total number of patents in this class: 2863
10-year publication summary
|
252
|
249
|
268
|
272
|
284
|
238
|
189
|
177
|
123
|
40
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Yazaki Corporation | 6282 |
113 |
| Apple Inc. | 50209 |
103 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
73 |
| Foxconn Interconnect Technology Limited | 1034 |
64 |
| Hon Hai Precision Industry Co., Ltd. | 4157 |
63 |
| Molex, LLC | 1792 |
53 |
| TE Connectivity Solutions GmbH | 2580 |
48 |
| Aptiv Technologies AG | 2097 |
47 |
| Japan Aviation Electronics Industry, Limited | 1585 |
42 |
| Hewlett-Packard Development Company, L.P. | 28538 |
34 |
| Microsoft Technology Licensing, LLC | 51439 |
28 |
| Tyco Electronics Japan G.K. | 382 |
27 |
| Samsung Electronics Co., Ltd. | 131630 |
25 |
| Huawei Technologies Co., Ltd. | 100781 |
21 |
| Snap Inc. | 4604 |
21 |
| PPC Broadband, Inc. | 1017 |
21 |
| Rosenberger Hochfrequenztechnik GmbH & Co. KG | 677 |
19 |
| Intel Corporation | 45621 |
18 |
| Dell Products L.P. | 11144 |
18 |
| Wistron Corporation | 2270 |
17 |
| Other owners | 2008 |